Isothermal Forging of TiAl-based Intermetallic Compounds.

Hot Deformation Behavior and Pulse Current Auxiliary Isothermal Forging of Hot Pressing Sintering TiAl Based Alloys

This paper focuses on the fabrication of as-forged Ti46.5Al2Cr1.8Nb-(W, B) alloy via pulse current auxiliary isothermal forging (PCIF). The starting material composed of near gamma (NG) microstructure was fabricated by adopting pre-alloyed powders via hot pressing sintering (HPS) at 1300 °C. Isothermal compression tests were conducted at a strain rate range of 0.001-0.1 s-1 and a temperature ra...

Isothermal and cyclic oxidation of TiAl composites

Titanium Aluminide and TiAl matrix composites reinforced with alumina fibers (PRD166) were fabricated by powder metallurgy. During isothermal oxidation at 950 and 1070 OC, composites containing PRD166 fibers exhibited larger weight gains than monolithic TiAI; the composites showed evidence of oxidation along the perimeter of the fibers. A fiber reaction, which was observed after oxidation in ai...

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

Copper wires are increasingly used in place of gold wires for making bonded interconnections in microelectronics. There are many potential benefits for use of copper in these applications, including better electrical and mechanical properties, and lower cost. Usually, wires are bonded to aluminum contact pads. However, the growth of Cu/Al intermetallic compounds (IMC) at the wire/pad interfaces...

Prediction of forging force and barreling behavior in isothermal hot forging of AlCuMgPb aluminum alloy using artificial neural network

In the present investigation, an artificial neural network (ANN) model is developed to predict the isothermal hot forging behavior of AlCuMgPb aluminum alloy. The inputs of the ANN are deformation temperature, frictional factor, ram velocity and displacement whereas the forging force, barreling parameter and final shape are considered as the output variable. The developed feed-forward back-prop...

Thermal Expansion of Several Sn-based Intermetallic Compounds